Dongguan MENTO Intelligent Technology Co., Ltd. asako@mento-mv.com 00-86-14775950818
As electronic components continue to shrink, manufacturers are facing tighter tolerances in quality control. Viscom's 3D automated optical inspection (AOI) systems are designed to address those requirements through multi-angle imaging and 3D measurement, according to the company.
Viscom's 3D AOI platform uses up to eight lateral cameras combined with 3D fringe projection to address common inspection problems, including solder-volume calculation and occlusion by complex components. The configuration is intended to reduce lateral inaccuracies and improve recording speed.
The system's 360View function lets operators select viewing angles, allowing high-fidelity 3D images to be captured from unobstructed perspectives. That capability is intended to support precise defect classification and deeper analysis of components such as chips that can block views of solder joints.
Viscom offers several optical inspection configurations for different production environments:
| System model | Application scenario |
|---|---|
| iS6059 Dual Lane | Dual-lane production line inspection |
| iS6059 PCB Inspection Plus | High-standard PCB quality assurance |
| iS6059 PCB Inspection | Standard production line inspection |
| iS6059 Double-Sided Inspection | Double-sided PCB inspection |
| iS6059 THT Inspection | PCB underside and THT component inspection |
The systems emphasize straightforward programming and flexible deployment, according to the company. They are designed to adapt quickly to product changeovers as well as high-volume production requirements.
Viscom also offers manual AOI systems as standalone desktop tools outside the production line. These systems are intended for medium-volume production, prototyping and offline programming, allowing quality checks at multiple stages of the manufacturing process.
The range of configurations reflects the varying demands of electronics manufacturing, from dual-lane lines and standard PCB inspection to double-sided boards and through-hole technology components. The iS6059 THT Inspection model, for example, is specifically optimized for inspecting the underside of circuit boards and THT components.
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