Dongguan MENTO Intelligent Technology Co., Ltd. asako@mento-mv.com 00-86-14775950818
DIP (dual in-line package) assembly is often treated as the "legacy" half of a PCB line: components are inserted, the board crosses a wave solder pot, and the section is considered done. In practice the through-hole stage is where field failures are born — a pin that never entered its hole, a reversed electrolytic capacitor, or a solder hole that looks closed but is not wetted. None of these are visible once the board disappears into final assembly.
MENTO's answer is a line architecture rather than a single machine. The standard DIP configuration runs component insertion machine → DIP AOI before wave solder → wave solder → DIP 2D/3D AOI after wave solder → work station: one closed loop from insertion to touch-up.
The pre-wave AOI station sits immediately after the component insertion machine. Its job is to verify that every action the operator (or the inserter) took is correct before irreversible thermal work happens:
Boards that fail here are corrected at the insertion station, so the pot only sees assemblies that are mechanically ready for it.
The wave solder process itself is left untouched. MENTO hands the pot a verified board and returns data on what came out of it; flux, preheat and wave parameters stay under the customer's own recipe control.
Downstream of the pot, a second AOI station inspects the finished joints in 2D and 3D, closing out the classic wave solder defect set:
On the K2005DT online dual-track platform, both rails can run different products at the same time, and the system keeps full-board images for traceability. Nominal specification of the platform:
| Parameter | K2005DT specification |
|---|---|
| Inspection items | CHIP body, CHIP solder joints, characters, DIP solder joints |
| Minimum component | CHIP 01005, pitch 0.3 mm |
| Camera | 5 MP high-speed colour industrial camera |
| Telecentric lens | 0.345X / 0.22X / 0.17X |
| Resolution / FOV | 10–20 µm; 24×20 to 48×40 mm |
| Inspection speed | 3 FOV/s |
| Positioning accuracy | ≤8 µm after calibration |
| PCB thickness | 0.3–10 mm (warp ≤5 mm) |
| Component height | Upper 30 mm, lower 84 mm (customisable) |
| PCB size | 600×300 mm dual rail (double board) / 600×580 mm single |
| Line interface | Standard SMEMA |
| Detection method | Algorithm parameter debugging + machine learning |
The last block in the loop is the rework bench. Because every alarm carries its own image, coordinates and defect class, the operator receives a worklist instead of a suspicion. Boards are repaired once, verified once, and returned to the line.
An AOI station that only lights up a red box is a sorting machine. MENTO's software layer adds the pieces that make the DIP line measurable:
| Company | MENTO Intelligent Technology Co., Ltd. (Dongguan, China) |
|---|---|
| Established | 2010 |
| Employees | 300 – 500 |
| Customers served | 5,000+ |
| Export share | 80% – 90% |
| Core technology | Machine vision software, precision optics, AI classification |
| DIP line solution | Pre-wave AOI → wave solder → 2D/3D post-wave AOI → work station |
The through-hole section does not need more operators; it needs two measurement points placed where defects are still reversible. Inserting AOI before and after the wave solder pot turns a blind thermal process into a closed loop, and turns inspection data into a process-control asset. That is the design logic behind MENTO's DIP line configuration — insertion, verification, soldering, verification again, and a repair station that always knows exactly what it is repairing.